PREPARATION OF SEMICONDUCTOR LEAD FRAME AND PREPARATION OF SEMICONDUCTOR CHIP PACKAGE USING IT

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor lead frame, which can prevent the interface between a lead frame pad and a molding resin from being peeled, and a method of manufacturing a semiconductor package, which utilizes the method of manufacturing the lead frame. SOL...

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Bibliographische Detailangaben
Hauptverfasser:	KIN SHIYOUKUN, CHIN SEIMIN, KOU JINSHIYAKU, RI SOUKOKU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor lead frame, which can prevent the interface between a lead frame pad and a molding resin from being peeled, and a method of manufacturing a semiconductor package, which utilizes the method of manufacturing the lead frame. SOLUTION: A polyamic acid film 400 is made to adhere to the bottom of a lead frame pad 450, the film 400 is polymerized by thermocompression bonding and a polyimide film 410 is formed.