HANDLING METHOD FOR IC SOCKET AND SEMICONDUCTOR DEVICE USING IT

PROBLEM TO BE SOLVED: To provide an IC socket by which leads of a semiconductor device and contact pins are brought into contact with each other soon after the conveying thereof. SOLUTION: IC socket S is provided with a socket main body 1 in which a device mounting portion 1a holding a semiconductor...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	TAKAHASHI MOTOMU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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