HANDLING METHOD FOR IC SOCKET AND SEMICONDUCTOR DEVICE USING IT

PROBLEM TO BE SOLVED: To provide an IC socket by which leads of a semiconductor device and contact pins are brought into contact with each other soon after the conveying thereof. SOLUTION: IC socket S is provided with a socket main body 1 in which a device mounting portion 1a holding a semiconductor device 2 at a predetermined position, a contact pin 4 which is fitted to the socket main body 1 and connects the semiconductor device 2 and a predetermined test circuit 3, a suction pad 6 which is set on the bottom face portion 1b of the socket main body 1 so as to open on the device mounting portion 1a, and negative pressure-sucks one side face of the semiconductor device 2 on the device mounting portion 1a so that leads 2a provided thereto are pushed to contact pins 4. The suction pad 6 protrudes from the bottom face portion 1b by such a length as the leads 2a are brought into the most suitable contact state with the contact pins 4 when the same sucks the semiconductor device 2.