HANDLING METHOD FOR IC SOCKET AND SEMICONDUCTOR DEVICE USING IT

PROBLEM TO BE SOLVED: To provide an IC socket by which leads of a semiconductor device and contact pins are brought into contact with each other soon after the conveying thereof. SOLUTION: IC socket S is provided with a socket main body 1 in which a device mounting portion 1a holding a semiconductor...

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1. Verfasser:	TAKAHASHI MOTOMU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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creator	TAKAHASHI MOTOMU
description	PROBLEM TO BE SOLVED: To provide an IC socket by which leads of a semiconductor device and contact pins are brought into contact with each other soon after the conveying thereof. SOLUTION: IC socket S is provided with a socket main body 1 in which a device mounting portion 1a holding a semiconductor device 2 at a predetermined position, a contact pin 4 which is fitted to the socket main body 1 and connects the semiconductor device 2 and a predetermined test circuit 3, a suction pad 6 which is set on the bottom face portion 1b of the socket main body 1 so as to open on the device mounting portion 1a, and negative pressure-sucks one side face of the semiconductor device 2 on the device mounting portion 1a so that leads 2a provided thereto are pushed to contact pins 4. The suction pad 6 protrudes from the bottom face portion 1b by such a length as the leads 2a are brought into the most suitable contact state with the contact pins 4 when the same sucks the semiconductor device 2.
format	Patent
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SOLUTION: IC socket S is provided with a socket main body 1 in which a device mounting portion 1a holding a semiconductor device 2 at a predetermined position, a contact pin 4 which is fitted to the socket main body 1 and connects the semiconductor device 2 and a predetermined test circuit 3, a suction pad 6 which is set on the bottom face portion 1b of the socket main body 1 so as to open on the device mounting portion 1a, and negative pressure-sucks one side face of the semiconductor device 2 on the device mounting portion 1a so that leads 2a provided thereto are pushed to contact pins 4. 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SOLUTION: IC socket S is provided with a socket main body 1 in which a device mounting portion 1a holding a semiconductor device 2 at a predetermined position, a contact pin 4 which is fitted to the socket main body 1 and connects the semiconductor device 2 and a predetermined test circuit 3, a suction pad 6 which is set on the bottom face portion 1b of the socket main body 1 so as to open on the device mounting portion 1a, and negative pressure-sucks one side face of the semiconductor device 2 on the device mounting portion 1a so that leads 2a provided thereto are pushed to contact pins 4. The suction pad 6 protrudes from the bottom face portion 1b by such a length as the leads 2a are brought into the most suitable contact state with the contact pins 4 when the same sucks the semiconductor device 2.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record>
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subjects	BASIC ELECTRIC ELEMENTS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
title	HANDLING METHOD FOR IC SOCKET AND SEMICONDUCTOR DEVICE USING IT
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