COOLING PANEL

PROBLEM TO BE SOLVED: To remove water droplets generated by dew formation at a cooling panel provided with a thermo-electrical element. SOLUTION: A cooling panel 1 is comprised of an N-type semiconductor 2a, a P-type semiconductor 2b, a metallic plate electrode 3, an electrical insulator 5, a therma...

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Bibliographische Detailangaben
Hauptverfasser:	YOSHIOKA CHIKAKO, HAYASHIBARA MITSUO
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING COMBINED HEATING AND REFRIGERATION SYSTEMS ELECTRICITY HEAT PUMP SYSTEMS HEATING LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING REFRIGERATION MACHINES, PLANTS OR SYSTEMS REFRIGERATION OR COOLING WEAPONS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To remove water droplets generated by dew formation at a cooling panel provided with a thermo-electrical element. SOLUTION: A cooling panel 1 is comprised of an N-type semiconductor 2a, a P-type semiconductor 2b, a metallic plate electrode 3, an electrical insulator 5, a thermal conductor 6 and a thermal insulating member 7. A hydrophobic film 8 is fixed to a cooling side (a heat absorbing) side of the panel 1. It is possible to remove water droplets formed as dew at a cooling surface due to water repelling characteristic of the hydrophobic film 8.