PARTIAL PLATING DEVICE
PROBLEM TO BE SOLVED: To provide a partial plating device which is capable of increasing a plating current density and shortening the plating time and with which uniform plating is obtainable without the occurrence of disturbance in plating liquid flow. SOLUTION: This partial plating device for plat...
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| creator | MIYAMOTO KATSUYOSHI AKASAKI EIICHI |
| description | PROBLEM TO BE SOLVED: To provide a partial plating device which is capable of increasing a plating current density and shortening the plating time and with which uniform plating is obtainable without the occurrence of disturbance in plating liquid flow. SOLUTION: This partial plating device for plating the desired points of a material to be plated is integrally provided with masks 4a, 4b in contact with the points not requiring the plating at the front end of a plating liquid ejector 11, by which the need for supporting the masks is eliminated. The plating liquid ejector 11 is provided with an ejecting part 13 along the flanks of the masks. Further, the plating liquid ejector has plural nozzles or slits. |
| format | Patent |
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SOLUTION: This partial plating device for plating the desired points of a material to be plated is integrally provided with masks 4a, 4b in contact with the points not requiring the plating at the front end of a plating liquid ejector 11, by which the need for supporting the masks is eliminated. The plating liquid ejector 11 is provided with an ejecting part 13 along the flanks of the masks. Further, the plating liquid ejector has plural nozzles or slits.</description><edition>6</edition><language>eng</language><subject>APPARATUS THEREFOR ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; SEMICONDUCTOR DEVICES</subject><creationdate>1997</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19970210&DB=EPODOC&CC=JP&NR=H0941184A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19970210&DB=EPODOC&CC=JP&NR=H0941184A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIYAMOTO KATSUYOSHI</creatorcontrib><creatorcontrib>AKASAKI EIICHI</creatorcontrib><title>PARTIAL PLATING DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a partial plating device which is capable of increasing a plating current density and shortening the plating time and with which uniform plating is obtainable without the occurrence of disturbance in plating liquid flow. SOLUTION: This partial plating device for plating the desired points of a material to be plated is integrally provided with masks 4a, 4b in contact with the points not requiring the plating at the front end of a plating liquid ejector 11, by which the need for supporting the masks is eliminated. The plating liquid ejector 11 is provided with an ejecting part 13 along the flanks of the masks. 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SOLUTION: This partial plating device for plating the desired points of a material to be plated is integrally provided with masks 4a, 4b in contact with the points not requiring the plating at the front end of a plating liquid ejector 11, by which the need for supporting the masks is eliminated. The plating liquid ejector 11 is provided with an ejecting part 13 along the flanks of the masks. Further, the plating liquid ejector has plural nozzles or slits.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES |
| title | PARTIAL PLATING DEVICE |
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