PARTIAL PLATING DEVICE

PARTIAL PLATING DEVICE

PROBLEM TO BE SOLVED: To provide a partial plating device which is capable of increasing a plating current density and shortening the plating time and with which uniform plating is obtainable without the occurrence of disturbance in plating liquid flow. SOLUTION: This partial plating device for plat...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MIYAMOTO KATSUYOSHI, AKASAKI EIICHI
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a partial plating device which is capable of increasing a plating current density and shortening the plating time and with which uniform plating is obtainable without the occurrence of disturbance in plating liquid flow. SOLUTION: This partial plating device for plating the desired points of a material to be plated is integrally provided with masks 4a, 4b in contact with the points not requiring the plating at the front end of a plating liquid ejector 11, by which the need for supporting the masks is eliminated. The plating liquid ejector 11 is provided with an ejecting part 13 along the flanks of the masks. Further, the plating liquid ejector has plural nozzles or slits.