SOLDER RESIST AND TAPE CARRIER FOR TAB

PROBLEM TO BE SOLVED: To provide a TAB tape carrier which is free from warpage and excellent in adhesion to sealing resin by a method wherein solder resist is formed of epoxy resin below a specific value in heat deformation temperature. SOLUTION: Epoxy solder resist whose heat deflection temperature measured through a prescribed measuring method is below 70 deg.C is used. A cured epoxy resist sheet 7 of thickness 0.1mm is formed, wound on a mandrel 13 of 40 , and heated for five minutes in the air. Then, the sheet 7 is made to stand for cooling off, separated from the mandrel 13, and measured to obtain a deformation rate(DR) based on a following formula, DR=(x/t)×100(%), wherein X denotes a distance between a reference plane in contact with the ends of the sheet 7 and the surface center point of the sheet 7, and t is a distance between a reference plane in contact with the ends of the sheet 7 and the surface center point of the sheet 7 when the sheet 7 is wound on the mandrel 13 and 7.5mm long by calculation. Heating temperatures in the air and deformation rates are plotted, and a temperature at which the sheets 7 changes markedly in deformation rate is defined as a heat deformation temperature.