LIQUID ADHESIVE FOR ELECTRONIC PART AND ADHESIVE TAPE

PROBLEM TO BE SOLVED: To obtain a liquid adhesive for electronic parts, prepared by dissolving a specific resin mixture an specific plural compounds containing nitrogen into an organic solvent, capable of adhering and curing at low temperature, excellent in heat resistance and electrical reliability...

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Bibliographische Detailangaben
Hauptverfasser: HASHIMOTO TAKESHI, TOCHIHIRA JIYUN
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To obtain a liquid adhesive for electronic parts, prepared by dissolving a specific resin mixture an specific plural compounds containing nitrogen into an organic solvent, capable of adhering and curing at low temperature, excellent in heat resistance and electrical reliability and useful as a tape for fixation of lead frame and the like. SOLUTION: This adhesive is prepared by dissolving (B) an acryronitrile- butadiene copolymer, (C) a phenol resin, (D) an epoxy resin, (E) a compound bearing at least two maleimide moieties and (F) a compound of the formula: H2 N-R -NH2 (R is a divalent aliphatic group, an aromatic group and an alicyclic group) or a compound of the formula (R is R ; (n) is 0-7) into (A) an organic solvent and the components B-F are contained at ratios that the total amount of the components (C)-(F) is 10-900 pts.wt. based on 100 pts.wt. of component A, the total amount of the components C and D is 10-90 pts.wt. based on 100 pts.wt. of the sum of components E and F and the amino group in the component F is 0.01-2.0 equivalent based on 1 mole equivalent of maleimide group in the component E.