CHIP-TYPE ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To prevent permeation of plating liquid, water content, etc., from the outside, by forming a constituting part member of a chip-type electronic component, containing at least a capacitor part and a resistor on a first glass layer formed on the upper surface of an insulating substrate, covering the respective members with a protecting layer having a second glass layer, and sealing the respective members between both of the glass layers. SOLUTION: A first rectangular glass layer 2 is formed on the upper surface of a ceramic insulating substrate 1. A pair of right and left surface electrodes 3, 4 spanning an exposed part of the upper surface of the substrate 1 and the first glass layer 2 and a lower electrode 5 for capacitor are formed on the first glass layer 2. After dielectricer 6 for a capacitor which partially overlaps the upper surface of the lower electrode 5 is formed, an upper electrode 7 for a capacitor which overlaps the surface electrode 4 and the dielectric 6 is formed. A resistor 8, spanning the surface electrode 3 and the lower electrode 5, is formed on the first glass layer 2. A capacitor part and the resistor 8 are covered with a protective glass 9. After trimming adjustment, second and third protective glass 10, 11 are formed for sealing.