HEAT SINK AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To tightly couple a mounted module with plate fins by planting many plate fins having superior heat radiation performance on the nonferrous metal- made module the top end of which is made of a high thermal conductivity metal melt, buried and hardened. SOLUTION: The heat sink A...

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Bibliographische Detailangaben
Hauptverfasser:	SOGAISHI ICHIRO, TSUCHIDA RYUICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To tightly couple a mounted module with plate fins by planting many plate fins having superior heat radiation performance on the nonferrous metal- made module the top end of which is made of a high thermal conductivity metal melt, buried and hardened. SOLUTION: The heat sink A comprises plate fins 2 planted with specified spacings in parallel on a mounting module 1 having parallelepiped plate pieces so that the increase of the fluid resistance matches the increase rate of the thermal conduction area. Each fin has a small thickness(t), specified length(s) and specified height(h). A drop stopper 3 is formed on the top end of the fin 2. The top ends of the fins 2 are buried in a molten nonferrous metal C different from the material of the fin to form the heat sink A. Since the heat sink A comprises the fins made of a material different from that of the module, the heat radiation performance of the fin can be improved.