MANUFACTURE OF LAMINATED CHIP TRANSFORMER

PROBLEM TO BE SOLVED: To provide a method of manufacturing which facilitates suppression of the leakage flux by simply burying nonmagnetic pieces between coils and between coil wires. SOLUTION: The process comprises a first step of forming winding patterns 6a, 6b on a magnetic board 8, second step o...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ISHINO AKIO, SAITO HIDEAKI, MURAKAMI IKKAN
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method of manufacturing which facilitates suppression of the leakage flux by simply burying nonmagnetic pieces between coils and between coil wires. SOLUTION: The process comprises a first step of forming winding patterns 6a, 6b on a magnetic board 8, second step of forming a nonmagnetic pattern on the upper surfaces of the winding patterns along the space between these patterns with leaving one end of each winding pattern exposed, third step of forming a magnetic pattern 16 of specified thickness on other part than the nonmagnetic pattern and these exposed parts to make flush with the upper surface of the nonmagnetic pattern, 4-th step of forming a next upper layer winding pattern with overlapped on the exposed parts, thereby connecting spirally and repeats the second to 4-th step to form coaxially disposed spiral coils with the winding patterns.