MANUFACTURE OF LAMINATED CHIP TRANSFORMER
PROBLEM TO BE SOLVED: To provide a method of manufacturing which facilitates suppression of the leakage flux by simply burying nonmagnetic pieces between coils and between coil wires. SOLUTION: The process comprises a first step of forming winding patterns 6a, 6b on a magnetic board 8, second step o...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a method of manufacturing which facilitates suppression of the leakage flux by simply burying nonmagnetic pieces between coils and between coil wires. SOLUTION: The process comprises a first step of forming winding patterns 6a, 6b on a magnetic board 8, second step of forming a nonmagnetic pattern on the upper surfaces of the winding patterns along the space between these patterns with leaving one end of each winding pattern exposed, third step of forming a magnetic pattern 16 of specified thickness on other part than the nonmagnetic pattern and these exposed parts to make flush with the upper surface of the nonmagnetic pattern, 4-th step of forming a next upper layer winding pattern with overlapped on the exposed parts, thereby connecting spirally and repeats the second to 4-th step to form coaxially disposed spiral coils with the winding patterns. |
---|