CONNECTING DEVICE

PROBLEM TO BE SOLVED: To enhance the durability of a conductive sheet. SOLUTION: A plurality of contact conductors 22 are formed on an upper face of a wiring board 21. A conductive sheet 16 is laid on the wiring board 21 to be in touch with each contact conductor 22. The conductive sheet 16 is kept...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ICHIKAWA KIMINORI, KOBAYASHI HIROYUKI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To enhance the durability of a conductive sheet. SOLUTION: A plurality of contact conductors 22 are formed on an upper face of a wiring board 21. A conductive sheet 16 is laid on the wiring board 21 to be in touch with each contact conductor 22. The conductive sheet 16 is kept in a state that many conductive wires 18 penetrating an insulating elastic sheet material 17 in a thicknesswise direction are insulated from each other. Each wire 18 is bent like a bow with both ends thereof set on the same line connecting upper and lower faces of the conductive sheet 16. When a BGA.IC1 is pressed into touch with the conductive sheet 16, a bump electrode 3 is electrically connected to the contact conductor 22 via the wire 18. Since the wire does not buckle, but is bent further and elastically deformed when the bump electrode is pressed, the wire, eventually, conductive sheet is improved in durability. Accordingly, the exchange frequency of the conductive sheet is lowered.