PACKAGING METHOD OF ELECTRONIC PART

PROBLEM TO BE SOLVED: To provide the title packaging method of electronic part capable of making feasible of cutting down the packaging time of electronic part and the simplification of packaging equipment. SOLUTION: Within the title simultaneously packaging method of electronic parts in parallel with one another on two each of printed boards wherein an electronic part is previously packaged on the other surface of the first board while one surface of the first board and the other surface of the second surface are printed a solder paste. Next, the electronic parts are fitted to the solder paste printed parts of one surface of the first board and the other surface of the second board to perform the reflow step. Thus the package of the electronic parts on the first board is finished. On the other hand, both sides of the second board is inverted so that one surface thereof may be printed with the solder paste simultaneously to print one surface of the third board with the solder paste in parallel therewith. Likewise, said respective packaging steps are successively performed changing the printed boards.