LEAD ASSEMBLING METHOD TO SEMICONDUCTOR CHIP

PROBLEM TO BE SOLVED: To reduce a stress given to a chip by providing a polyamide coating layer in an imperfectly hardened state on the upper surface of a semiconductor chip, by pasting polyamide tape on the lower surface of a lead and by mounting the tape on the chip and hardening after pressing so...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SOU EIKI, CHIN SEIMIN, SON KAITEI, KEN NEIDO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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