LEAD ASSEMBLING METHOD TO SEMICONDUCTOR CHIP

PROBLEM TO BE SOLVED: To reduce a stress given to a chip by providing a polyamide coating layer in an imperfectly hardened state on the upper surface of a semiconductor chip, by pasting polyamide tape on the lower surface of a lead and by mounting the tape on the chip and hardening after pressing so...

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Bibliographische Detailangaben
Hauptverfasser: SOU EIKI, CHIN SEIMIN, SON KAITEI, KEN NEIDO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To reduce a stress given to a chip by providing a polyamide coating layer in an imperfectly hardened state on the upper surface of a semiconductor chip, by pasting polyamide tape on the lower surface of a lead and by mounting the tape on the chip and hardening after pressing so as to bring a non-pasting layer surface into contact with the polyamide coating layer. SOLUTION: A polyamide coating layer 50 in an imperfectly hardened state is provided on the upper surface of a chip 10. A pasting layer 84 of a polyamide tape 80 is pasted on the lower surface of a lead 22 and is assembled on the chip 10. After the lead frame on which the tape 80 is pasted so as to be brought into contact with the polyamide coating layer 50 in an imperfectly hardened state provided on the upper surface of the chip 10 is aligned on the upper side of the chip 10, the tape 80 and the chip 10 are assembled by pressing the lead frame by a pressing means. The number of phase boundaries between the lead and the chip is reduced and a stress due to the pressing means during assembling time of the lead to the chip can be reduced by mediating the polyamide tape.