WAFER CARRIER

PROBLEM TO BE SOLVED: To provide a wafer carrier wherein arrangement of wafers can be omitted at each manufacturing apparatus to reduce manufacturing processing time by adding a wafer arranging mechanism to the wafer carrier. SOLUTION: Wafers 14 are pushed toward a reference member by a pressing rol...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YOSHIKAWA YUUKI, YANAGIHARA MASAMITSU
Format:	Patent
Sprache:	eng
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR BASIC ELECTRIC ELEMENTS CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING HANDLING THIN OR FILAMENTARY MATERIAL NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS PHYSICS SEMICONDUCTOR DEVICES STORING TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a wafer carrier wherein arrangement of wafers can be omitted at each manufacturing apparatus to reduce manufacturing processing time by adding a wafer arranging mechanism to the wafer carrier. SOLUTION: Wafers 14 are pushed toward a reference member by a pressing roller 9 attached to a roller attaching shaft 10 and held in a state arranged on a shelf 3 in a wafer carrier. When the wafer carrier is moved to a predetermined place, the roller attaching shaft can fall due to its own weight, whereby the roller attaching shaft is rotated by a ball nut 6, and the pressing roller rotates from a state in which the press the wafers to a position distant from the wafers. The wafer in the wafer carrier are received in an arranged state by being pushing by the pressing roller with proper force and pressing is canceled at a predetermined place, so that the wafers need not be arranged in each manufacturing device, thereby reducing manufacturing processing time.