SEMICONDUCTOR CHIP, MANUFACTURING METHOD THEREOF AND WIRE BONDING METHOD

PROBLEM TO BE SOLVED: To prevent bonding pads from corrosion to deteriorate during the reliability test of a semiconductor package, by forming a second metal layer at the peripheries of windows of a passivation layer to form bonding windows. SOLUTION: Specified circuit elements are formed on a semiconductor substrate, a surface flat layer 12 is coated on the surface of the substrate, and bonding pads 14 formed on this flat layer 12 are electrically connected to the circuit elements. A passivation layer 16 having windows to open part of the bonding pads 14 are formed on the flat layer 12. A second metal layer 18a has the same height as that of the passivation layer 16 and occupies the peripheries of the windows to form bonding windows 19a of the pads 14. The size of the bonding window 19a is e.g. less than that of a wire ball 20 to be mounted on the bonding pads 14 throughout the wire bonding process.