MANUFACTURE OF LEAD FRAME

PROBLEM TO BE SOLVED: To prevent lead deformation even if there are multiple pins and to achieve high productivity with improved yield by providing a plurality of conductors longitudinally and laterally in lattice configuration and by cutting away the parts other than those required as leads and pad...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YASUMOTO HIROMICHI, OKAMOTO HISATO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator YASUMOTO HIROMICHI
OKAMOTO HISATO
description PROBLEM TO BE SOLVED: To prevent lead deformation even if there are multiple pins and to achieve high productivity with improved yield by providing a plurality of conductors longitudinally and laterally in lattice configuration and by cutting away the parts other than those required as leads and pads. SOLUTION: Thin metal wires are used as conductors 1, and the conductors 1 are provided longitudinally and laterally as longitudinal conductors 1a and lateral conductors 1b. The longitudinal conductors 1a and lateral conductors 1b are provided so that lattice-type parts 2 are formed with predetermined spacing between them. The longitudinal conductors 1a and lateral conductors 1b extending outward from the lattice-type parts 2 are divided at the midway between adjacent lattice-type parts 2 to form leads. Further, an insulating material 3 is provided on the lattice-type parts 2, and at the same time the longitudinal conductors 1a and lateral conductors 1b extending outward from the lattice-type parts 2 are connected and supported by the insulating material 3. Then, the longitudinal conductors 1a and lateral conductors 1b projecting from the lattice-type part are cut from the side surface thereof. Further, the lattice-type parts 2 are used as pads. Thus, lead deformation is eliminated and higher density provision can cope with the formation of multiple pins with improved productivity.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH09283683A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH09283683A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH09283683A3</originalsourceid><addsrcrecordid>eNrjZJD0dfQLdXN0DgkNclXwd1PwcXV0UXALcvR15WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8V4BHgaWRhbGZhbGjsbEqAEAAccgAQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>MANUFACTURE OF LEAD FRAME</title><source>esp@cenet</source><creator>YASUMOTO HIROMICHI ; OKAMOTO HISATO</creator><creatorcontrib>YASUMOTO HIROMICHI ; OKAMOTO HISATO</creatorcontrib><description>PROBLEM TO BE SOLVED: To prevent lead deformation even if there are multiple pins and to achieve high productivity with improved yield by providing a plurality of conductors longitudinally and laterally in lattice configuration and by cutting away the parts other than those required as leads and pads. SOLUTION: Thin metal wires are used as conductors 1, and the conductors 1 are provided longitudinally and laterally as longitudinal conductors 1a and lateral conductors 1b. The longitudinal conductors 1a and lateral conductors 1b are provided so that lattice-type parts 2 are formed with predetermined spacing between them. The longitudinal conductors 1a and lateral conductors 1b extending outward from the lattice-type parts 2 are divided at the midway between adjacent lattice-type parts 2 to form leads. Further, an insulating material 3 is provided on the lattice-type parts 2, and at the same time the longitudinal conductors 1a and lateral conductors 1b extending outward from the lattice-type parts 2 are connected and supported by the insulating material 3. Then, the longitudinal conductors 1a and lateral conductors 1b projecting from the lattice-type part are cut from the side surface thereof. Further, the lattice-type parts 2 are used as pads. Thus, lead deformation is eliminated and higher density provision can cope with the formation of multiple pins with improved productivity.</description><edition>6</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>1997</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19971031&amp;DB=EPODOC&amp;CC=JP&amp;NR=H09283683A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19971031&amp;DB=EPODOC&amp;CC=JP&amp;NR=H09283683A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YASUMOTO HIROMICHI</creatorcontrib><creatorcontrib>OKAMOTO HISATO</creatorcontrib><title>MANUFACTURE OF LEAD FRAME</title><description>PROBLEM TO BE SOLVED: To prevent lead deformation even if there are multiple pins and to achieve high productivity with improved yield by providing a plurality of conductors longitudinally and laterally in lattice configuration and by cutting away the parts other than those required as leads and pads. SOLUTION: Thin metal wires are used as conductors 1, and the conductors 1 are provided longitudinally and laterally as longitudinal conductors 1a and lateral conductors 1b. The longitudinal conductors 1a and lateral conductors 1b are provided so that lattice-type parts 2 are formed with predetermined spacing between them. The longitudinal conductors 1a and lateral conductors 1b extending outward from the lattice-type parts 2 are divided at the midway between adjacent lattice-type parts 2 to form leads. Further, an insulating material 3 is provided on the lattice-type parts 2, and at the same time the longitudinal conductors 1a and lateral conductors 1b extending outward from the lattice-type parts 2 are connected and supported by the insulating material 3. Then, the longitudinal conductors 1a and lateral conductors 1b projecting from the lattice-type part are cut from the side surface thereof. Further, the lattice-type parts 2 are used as pads. Thus, lead deformation is eliminated and higher density provision can cope with the formation of multiple pins with improved productivity.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1997</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJD0dfQLdXN0DgkNclXwd1PwcXV0UXALcvR15WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8V4BHgaWRhbGZhbGjsbEqAEAAccgAQ</recordid><startdate>19971031</startdate><enddate>19971031</enddate><creator>YASUMOTO HIROMICHI</creator><creator>OKAMOTO HISATO</creator><scope>EVB</scope></search><sort><creationdate>19971031</creationdate><title>MANUFACTURE OF LEAD FRAME</title><author>YASUMOTO HIROMICHI ; OKAMOTO HISATO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH09283683A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1997</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>YASUMOTO HIROMICHI</creatorcontrib><creatorcontrib>OKAMOTO HISATO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YASUMOTO HIROMICHI</au><au>OKAMOTO HISATO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MANUFACTURE OF LEAD FRAME</title><date>1997-10-31</date><risdate>1997</risdate><abstract>PROBLEM TO BE SOLVED: To prevent lead deformation even if there are multiple pins and to achieve high productivity with improved yield by providing a plurality of conductors longitudinally and laterally in lattice configuration and by cutting away the parts other than those required as leads and pads. SOLUTION: Thin metal wires are used as conductors 1, and the conductors 1 are provided longitudinally and laterally as longitudinal conductors 1a and lateral conductors 1b. The longitudinal conductors 1a and lateral conductors 1b are provided so that lattice-type parts 2 are formed with predetermined spacing between them. The longitudinal conductors 1a and lateral conductors 1b extending outward from the lattice-type parts 2 are divided at the midway between adjacent lattice-type parts 2 to form leads. Further, an insulating material 3 is provided on the lattice-type parts 2, and at the same time the longitudinal conductors 1a and lateral conductors 1b extending outward from the lattice-type parts 2 are connected and supported by the insulating material 3. Then, the longitudinal conductors 1a and lateral conductors 1b projecting from the lattice-type part are cut from the side surface thereof. Further, the lattice-type parts 2 are used as pads. Thus, lead deformation is eliminated and higher density provision can cope with the formation of multiple pins with improved productivity.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JPH09283683A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title MANUFACTURE OF LEAD FRAME
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-11T19%3A58%3A51IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YASUMOTO%20HIROMICHI&rft.date=1997-10-31&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH09283683A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true