MANUFACTURE OF LEAD FRAME

PROBLEM TO BE SOLVED: To prevent lead deformation even if there are multiple pins and to achieve high productivity with improved yield by providing a plurality of conductors longitudinally and laterally in lattice configuration and by cutting away the parts other than those required as leads and pad...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YASUMOTO HIROMICHI, OKAMOTO HISATO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To prevent lead deformation even if there are multiple pins and to achieve high productivity with improved yield by providing a plurality of conductors longitudinally and laterally in lattice configuration and by cutting away the parts other than those required as leads and pads. SOLUTION: Thin metal wires are used as conductors 1, and the conductors 1 are provided longitudinally and laterally as longitudinal conductors 1a and lateral conductors 1b. The longitudinal conductors 1a and lateral conductors 1b are provided so that lattice-type parts 2 are formed with predetermined spacing between them. The longitudinal conductors 1a and lateral conductors 1b extending outward from the lattice-type parts 2 are divided at the midway between adjacent lattice-type parts 2 to form leads. Further, an insulating material 3 is provided on the lattice-type parts 2, and at the same time the longitudinal conductors 1a and lateral conductors 1b extending outward from the lattice-type parts 2 are connected and supported by the insulating material 3. Then, the longitudinal conductors 1a and lateral conductors 1b projecting from the lattice-type part are cut from the side surface thereof. Further, the lattice-type parts 2 are used as pads. Thus, lead deformation is eliminated and higher density provision can cope with the formation of multiple pins with improved productivity.