SEMICONDUCTOR DEVICE MOUNTING MEDIUM AND MOUNTING METHOD OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To enable a BGA package semiconductor device to be easily evaluated before it is mounted, enhanced in heat dissipating properties, and matched in lead inductance by a method wherein an insulating board is provided with through-holes opposed to pads, and solders bonded to metals...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	FUTAKI KAZUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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