SEMICONDUCTOR DEVICE MOUNTING MEDIUM AND MOUNTING METHOD OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To enable a BGA package semiconductor device to be easily evaluated before it is mounted, enhanced in heat dissipating properties, and matched in lead inductance by a method wherein an insulating board is provided with through-holes opposed to pads, and solders bonded to metals filled in the through-holes are made to extend from both the front and rear side of the insulating board. SOLUTION: A conductor layer 34 is deposited on the inner walls and around the openings of the through-holes 33 provided to the insulating board 32 of a semiconductor device mounting medium 31 respectively, the through-holes 33 are filled up with metal plugs 35, and a solder 37 protrudent like a hemisphere is deposited on the underside of the metal plug 35. Then, solder resists 38 and 39 are so formed on both the front and rear of the insulating board 32 as to enable only a required part to be coated with a solder layer 37, a proper amount of solder paste 40 is placed on the upside of the conductor layer 34, and the insulating board 32 is made to pass through a dip soldering device to enable the solder paste 40 to be melted and a jet of molten solder to come into contact the rear of the board 32.