PACKAGING METHOD OF SEMICONDUCTOR DEVICE AND PACKAGED STRUCTURE OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To prevent thermal stress from being produced owing to thermal contraction of a resin component, by filling a gap between a semiconductor device and a circuit board with the liquid resin mixture containing an inorganic filler, and hardening the resin mixture in the state where the inorganic mixture is located in the vicinity of a small thermal expansion coefficient member. SOLUTION: A gap between a semiconductor device 1 and a circuit board 4 is filled with a liquid resin mixture 7. The circuit board 4 is turned over and is heated at temperature of about 150 deg.C to harden the liquid resin mixture 7. The liquid resin mixture 7 contains at least resin 8 and an inorganic filler 9, in which a ratio of the resin 8 and the inorganic filler 9 is adjusted such that a thermal expansion coefficient of the resin mixture 10 after being hardened is coincident with that of a junction 6 of a conductive bonding agent. Further, the hardening is performed in the state wherte the inorganic filler 9 is displaced to the side of a small thermal expansion coefficient semiconductor device 1.