SEMICONDUCTOR DEVICE MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To produce an electronic parts-mounted semiconductor device, using an unwashed flux, without causing such trouble as voids and reduction of the insulation resistance. SOLUTION: Lands 2, 3 on a circuit board 1 are electrically and mechanically connected by solders 7, 8 to electr...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ISHIKAWA TOMONORI, OGISO HOMARE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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