SEMICONDUCTOR DEVICE MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To produce an electronic parts-mounted semiconductor device, using an unwashed flux, without causing such trouble as voids and reduction of the insulation resistance. SOLUTION: Lands 2, 3 on a circuit board 1 are electrically and mechanically connected by solders 7, 8 to electrodes 5, 6 of electronic parts 4 covered with a sealing resin 9 serving as a drip proof on the upper face of the board l. The resin 9 is an acrylic resin. In production, the lands 2, 3 on the board 1 are soldered to the electrodes 5, 6 of the electronic parts 4, using an unwashed flux 10 to mount the parts 4 on the board 1 and the parts 4 are covered with a defoaming agent-added sealing resin 13.