PRINTED CIRCUIT BOARD FOR RADIO IC CARD

PROBLEM TO BE SOLVED: To provide higher functions and higher capacity by making a circuit board thinner and using compact electronic parts such as IC by using two- layered printed circuit boards with each layer provided with a conductive metal on a single surface or double surfaces of an insulation...

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Hauptverfasser: TOYAMA SHUNROKU, NISHIKAWA TADAHIRO, AOYANAGI TSUTOMU
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Sprache:eng
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creator TOYAMA SHUNROKU
NISHIKAWA TADAHIRO
AOYANAGI TSUTOMU
description PROBLEM TO BE SOLVED: To provide higher functions and higher capacity by making a circuit board thinner and using compact electronic parts such as IC by using two- layered printed circuit boards with each layer provided with a conductive metal on a single surface or double surfaces of an insulation film without adhesion. SOLUTION: An insulation film 1 with drilled through-holes is set to a sputtering device, and a nickel/copper vapor deposition film 3 is formed on both surfaces. After the vapor deposition, electric copper plating 4 is performed in a high-concentration copper sulfate plating bath, both surface are laminated with photosensitive dry films, and a circuit pattern is formed by exposing to ultraviolet ray by using a mask. Other than the connecting portions and electronic parts mounting portion of a circuit pattern are masked with a resist, and electroless nickel 5 and electroless gold 6 are applied to an exposed circuit pattern portion. By doing this, the function and capacity of electronic parts such as IC can be enhanced, and high reliability access can be obtained for leader and rider.
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SOLUTION: An insulation film 1 with drilled through-holes is set to a sputtering device, and a nickel/copper vapor deposition film 3 is formed on both surfaces. After the vapor deposition, electric copper plating 4 is performed in a high-concentration copper sulfate plating bath, both surface are laminated with photosensitive dry films, and a circuit pattern is formed by exposing to ultraviolet ray by using a mask. Other than the connecting portions and electronic parts mounting portion of a circuit pattern are masked with a resist, and electroless nickel 5 and electroless gold 6 are applied to an exposed circuit pattern portion. 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subjects BOOK COVERS
BOOKBINDING
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FILES
HANDLING RECORD CARRIERS
LOOSE LEAVES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MOVABLE-STRIP WRITING OR READING APPARATUS
PERFORMING OPERATIONS
PHYSICS
PRESENTATION OF DATA
PRINTED CIRCUITS
PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES
PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR
RECOGNITION OF DATA
RECORD CARRIERS
SPECIAL PRINTED MATTER
TRANSPORTING
title PRINTED CIRCUIT BOARD FOR RADIO IC CARD
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