PRINTED CIRCUIT BOARD FOR RADIO IC CARD

PROBLEM TO BE SOLVED: To provide higher functions and higher capacity by making a circuit board thinner and using compact electronic parts such as IC by using two- layered printed circuit boards with each layer provided with a conductive metal on a single surface or double surfaces of an insulation...

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Bibliographische Detailangaben
Hauptverfasser:	TOYAMA SHUNROKU, NISHIKAWA TADAHIRO, AOYANAGI TSUTOMU
Format:	Patent
Sprache:	eng
Schlagworte:	BOOK COVERS BOOKBINDING CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILES HANDLING RECORD CARRIERS LOOSE LEAVES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MOVABLE-STRIP WRITING OR READING APPARATUS PERFORMING OPERATIONS PHYSICS PRESENTATION OF DATA PRINTED CIRCUITS PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR RECOGNITION OF DATA RECORD CARRIERS SPECIAL PRINTED MATTER TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide higher functions and higher capacity by making a circuit board thinner and using compact electronic parts such as IC by using two- layered printed circuit boards with each layer provided with a conductive metal on a single surface or double surfaces of an insulation film without adhesion. SOLUTION: An insulation film 1 with drilled through-holes is set to a sputtering device, and a nickel/copper vapor deposition film 3 is formed on both surfaces. After the vapor deposition, electric copper plating 4 is performed in a high-concentration copper sulfate plating bath, both surface are laminated with photosensitive dry films, and a circuit pattern is formed by exposing to ultraviolet ray by using a mask. Other than the connecting portions and electronic parts mounting portion of a circuit pattern are masked with a resist, and electroless nickel 5 and electroless gold 6 are applied to an exposed circuit pattern portion. By doing this, the function and capacity of electronic parts such as IC can be enhanced, and high reliability access can be obtained for leader and rider.