PRINTED WIRING BOARD MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To prevent dies from being broken by punching punched fragments at die-punching of printed wiring boards. SOLUTION: A starting board 28 having conductor patterns for printed wiring boards is drilled to form holes 28A at slits of the board 28 to be divided into the wiring boards...

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Bibliographische Detailangaben
Hauptverfasser:	YUSA MOTOO, OTA MASAYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To prevent dies from being broken by punching punched fragments at die-punching of printed wiring boards. SOLUTION: A starting board 28 having conductor patterns for printed wiring boards is drilled to form holes 28A at slits of the board 28 to be divided into the wiring boards and then form slits 28B whereby the punched fragments of one slit can be separated into several fragments and hence the fragments produced at forming the slits 8B can be short. Thus it is possible to realize a manufacturing method of a printed wiring board which prevents dies from being broken by the punched fragments at die-punching of the printed wiring board.