MULTILAYERED WIRING STRUCTURE AND ITS MANUFACTURE

PROBLEM TO BE SOLVED: To provide a reliable multilayered wiring structure by improving the coverage of the upper layer wirings within all through holes, and preventing polymer, etc., from remaining within the through holes. SOLUTION: A difference in level comes into being in the lower layer wirings 15 in a region A and a region B by the influence of the difference in level of a base, so the step on the interlayer insulating film 16 in the vicinity of the periphery of the through hole 19 in the region B is formed to make it lower than the flattened surface, and the thickness of the interlayer insulating film 16 in the vicinities of the peripheries of the several through holes 19 in the region A and the region B are made roughly the same. Furthermore, the aspect ratio of the through holes 19 in the region A and the region B are made roughly the same by making the depths of the through holes 19 in the region A and the region B roughly the same, whereby no through hole at high aspect ratio exists, and the coverage of the upper layer wiring 20 in the through holes 19 in the region A and the region B becomes good. No through hole overreached excessively exists, either, which can prevent polymer, etc., from remaining.