WAFER CARRYING METHOD

PROBLEM TO BE SOLVED: To prevent effectively the generation of slippage in a wafer when the wafer heated to a high temperature is carried. SOLUTION: A wafer W processed off under a high-temperature atmosphere in process modules PM1, PM2 is held by a tweezers T of a robot arm R provided in a transfer...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	TOYAMA KATSUJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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