WAFER CARRYING METHOD

PROBLEM TO BE SOLVED: To prevent effectively the generation of slippage in a wafer when the wafer heated to a high temperature is carried. SOLUTION: A wafer W processed off under a high-temperature atmosphere in process modules PM1, PM2 is held by a tweezers T of a robot arm R provided in a transfer module TM. Further, after its processing in the process modules PM1, PM2, when it is carried to cooling modules CS1, CS2, the process modules PM1, PM2, the transfer module TM and the cooling modules CS1, CS2 are evacuated to reduce their pressures and carry the wafer under a reduced pressure atmosphere by the robot arm R. As a result even when the tweezers T of a low temperature approaches the wafer W, heat is suppressed from conducting in a dissipating way from the wafer W to the tweezers T via an atmospheric gas to prevent the generation of slippage in the wafer W.