THERMOPLASTIC RESIN COMPOSITION AND ITS MOLDING PRODUCT

PROBLEM TO BE SOLVED: To obtain a thermoplastic resin composition, comprising polybenzazole fibers in a thermoplastic resin, excellent in toughness, heat resistance, electrical insulating properties, thermal conductivity, etc., and useful as an alternative material, etc., for a metal or ceramic. SOL...

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Bibliographische Detailangaben
Hauptverfasser:	MITANI HIDEKI, YOSHIHARA NORI, HIRAHATA HIROTSUGU
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a thermoplastic resin composition, comprising polybenzazole fibers in a thermoplastic resin, excellent in toughness, heat resistance, electrical insulating properties, thermal conductivity, etc., and useful as an alternative material, etc., for a metal or ceramic. SOLUTION: This thermoplastic resin composition comprises (B) polybenzazole fibers having preferably =0.40W/m.K thermal conductivity, >=4.0kg.cm/cm Izod impact strength and >=10 Ω.cm volume resistivity.