NEW EPOXY RESIN, ITS INTERMEDIATE, PRODUCTION THEREOF, EPOXY RESIN COMPOSITION MADE USING THE SAME, AND CURED ITEM THEREOF

PROBLEM TO BE SOLVED: To obtain an epoxy resin improved in resistances to moisture, heat, and impact, etc., by reacting a specific polyhydroxy resin with epichlorohydrin. SOLUTION: 1 mol of a phenol compd. selected from among optionally substd. phenols and naphthols is reacted with 0.05-0.9mol of a...

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Bibliographische Detailangaben
Hauptverfasser:	KAJI MASASHI, ARAMAKI TAKANORI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain an epoxy resin improved in resistances to moisture, heat, and impact, etc., by reacting a specific polyhydroxy resin with epichlorohydrin. SOLUTION: 1 mol of a phenol compd. selected from among optionally substd. phenols and naphthols is reacted with 0.05-0.9mol of a divinylbiphenyl compd. in the presence of an acid catalyst at 10-250 deg.C to provide polyhydroxy resin represented by formula I (wherein A is an optionally substd. benzene or naphthalene ring; G is glycidyl; and n is 0-15). 1mol of the hydroxyl groups of the resin is reacted with 0.8-2mol of epichlorohydrin in the presence of an alkali metal hydroxide at 50-150 deg.C for 1-10hr to give an epoxy resin represented by formula II.