EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE SEALED THEREWITH

PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in humidity resistance, soldering-heat resistance and moldability by mixing a specified epoxy resin with a phenolic resin, a specified silane coupling agent, a spherical alumina powder and a cure accelerator as the essential compon...

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Bibliographische Detailangaben
1. Verfasser:	SADO SATOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in humidity resistance, soldering-heat resistance and moldability by mixing a specified epoxy resin with a phenolic resin, a specified silane coupling agent, a spherical alumina powder and a cure accelerator as the essential components. SOLUTION: This epoxy resin composition consists essentially of an epoxy resin represented by the formula (wherein n is 0 or an integer of 1 or greater), a phenolic resin, an epoxy silane coupling agent represented by the formula: R -Cn H2n -Si(OR )3 (wherein R is an epoxy atomic group; R is methyl or ethyl; and (n) is 0 or an integer of 1 or greater), 25-90wt.%, based on the total resin composition, spherical alumina powder of a max. particle diameter of 100μm or below and a cure accelerator.