PRODUCTION OF POLYAMIDE RESIN INJECTION-IMOLDED OBJECT

PROBLEM TO BE SOLVED: To produce a resin injection-molded object by bonding a preformed molded object and an injection-molded object injected later by using a polyamide resin. SOLUTION: A molded object of which the surface layer composed of a polyamide resin of a bonding surface is allowed to absorb...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HOYA TAKAO, TAKADA SEIICHI, KATO MITSUYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To produce a resin injection-molded object by bonding a preformed molded object and an injection-molded object injected later by using a polyamide resin. SOLUTION: A molded object of which the surface layer composed of a polyamide resin of a bonding surface is allowed to absorb humidity or water to be lowered in glass transition temp. by 20-110 deg.C is held within a mold cavity larger than the molded object and other molten polyamide resin is injected into the residual mold cavity. By this method, the injection-molded object fused to the molded object through the bonding surface is obtained.