PRINTED WIRING BOARD MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To improve the insulation reliability by preventing a conductive paste from flowing into the interior or surface of a printed wiring board for use in electronic apparatus. SOLUTION: A flow block layer for blocking a conductive paste is formed on the surface of a board 2, ultrav...

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Bibliographische Detailangaben
Hauptverfasser:	TOYAMA OSAMU, IGUCHI TAKAYOSHI, MASAMOTO TAKASHI, HATTORI SHUJI, OCHI AKIO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To improve the insulation reliability by preventing a conductive paste from flowing into the interior or surface of a printed wiring board for use in electronic apparatus. SOLUTION: A flow block layer for blocking a conductive paste is formed on the surface of a board 2, ultraviolet beam 3 is directed both sides to harden the flow block layer 2 to some extent, a releasing layer 4 is formed, through- holes 5 are bored, by laser beam matching, etc., a conductive paste 6 is printed to fill the holes 5, the releasing layer 4 is peeled off, metal foils are pasted to both sides and hot pressed by a heat press. Thus a printed wiring board 13 having via-holes 8 having a high reliability is formed.