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PROBLEM TO BE SOLVED: To obtain a safe mold-removing or cleaning agent which comprises a combination of a chelating agent with a semiconductor photocatalyst without occurrence of noxious material, for example, chlorine gas. SOLUTION: This mold-removing or cleaning agent contains, as essential compon...

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1. Verfasser: KAMIUSUKI TOSHIAKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To obtain a safe mold-removing or cleaning agent which comprises a combination of a chelating agent with a semiconductor photocatalyst without occurrence of noxious material, for example, chlorine gas. SOLUTION: This mold-removing or cleaning agent contains, as essential components, (A) a chelating agent, preferably citric, oxalic acid, EDTA or their salt) and (B) a semiconductor photocatalyst (for example, titanium oxide, SnO2 , WO3 , SiO2 and Fe2 O3 , preferably titanium oxide). This composition is preferably applied in the form of an aqueous solution or dispersion. The proportion of component A is 0.1-50wt.%, preferably 5-20wt.%, while component B is 0.01-40wt.%, preferably 0.1-5wt.% in the composition.