PHOTOCURABLE EPOXY RESIN COMPOSITION FOR ELECTRONIC PART AND PRODUCTION OF ELECTRONIC PART WITH THE SAME

PHOTOCURABLE EPOXY RESIN COMPOSITION FOR ELECTRONIC PART AND PRODUCTION OF ELECTRONIC PART WITH THE SAME

PROBLEM TO BE SOLVED: To obtain a photocurable epoxy resin composition capable of being cured in a short time. SOLUTION: This photocurable epoxy resin composition for electronic parts comprises (A) 100 pts.wt. of an epoxy resin having two or more 1,2-epoxy groups in the molecule, (B) 5-30 pts.wt. of...

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Bibliographische Detailangaben
Hauptverfasser: OBARA MASAKATSU, OMORI EIJI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Zusammenfassung:PROBLEM TO BE SOLVED: To obtain a photocurable epoxy resin composition capable of being cured in a short time. SOLUTION: This photocurable epoxy resin composition for electronic parts comprises (A) 100 pts.wt. of an epoxy resin having two or more 1,2-epoxy groups in the molecule, (B) 5-30 pts.wt. of a rubbery elastic resin liquid at the ordinary temperature, (C) 150-350 pts.wt. of an inorganic filler, and (D) 0.1-20 pts.wt. of a group VIb element onium salt capable of receiving UV light to release a Lewis acid onium salt.