WAFER REPLACEMENT JIG

PROBLEM TO BE SOLVED: To perform replacement without damaging the work surface of a semiconductor wafer which was specularly polished and outer periphery part, relating to a wafer replacement jig of a semiconductor wafer in a device process, especially in a wafer replacement jig which replaces a sem...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	OKAMOTO KIMITAKA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL PACKING PERFORMING OPERATIONS PNEUMATIC TUBE CONVEYORS SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING
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