WAFER REPLACEMENT JIG

PROBLEM TO BE SOLVED: To perform replacement without damaging the work surface of a semiconductor wafer which was specularly polished and outer periphery part, relating to a wafer replacement jig of a semiconductor wafer in a device process, especially in a wafer replacement jig which replaces a semiconductor wafer of a large diameter whose front and rear surfaces were specularly polished. SOLUTION: A semiconductor wafer 100 is, between a plurality of fixed supporting beams 11-14 of a fixed holder 1 and a plurality of supporting claws 21-24 of a movable holder 2, clamped with free movement allowed, while contacting to the chamfered surface or an end rim surface, respectively. Thus, the clamping force acting between the fixed holder 1 and the movable holder 2 is suppressed only to its own weight without applying to the semiconductor wafer 100, so, the replacement operation is done without damaging a specularly polished surface and an outer periphery part.