MANUFACTURE OF CERAMIC SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method which eliminates a process, for applying cover coat on the bonding pad on the surface of a ceramic multilayer substrate. SOLUTION: Green sheets 1 whereupon an interconnection pattern 3 is formed are laminated, the laminate is sandwiched with film sheets 2 from the top and bottom, and the laminate and the film sheets are sandwiched with bonding jigs 5 and 5'. A cover coat pattern 4 is previously formed on the film sheet. A laminate which has the cover coat pattern 4 on the bonding pad on the surface is provided. Thus, natural drying and flattening press after conductor paste printing, which are required by the method of printing the cover coat pattern on the printed conductor paste of the bonding pad by the conventional technology, can be eliminated.