METHOD AND APPARATUS FOR SPIN-DRYING SEMICONDUCTOR WAFER

PROBLEM TO BE SOLVED: To eliminate uneven drying and reduce an occupation area of an apparatus by altering the direction of lamination of a wafer block in a direction parallel to the center axis of rotation of a revolution turning shaft, and turning the wafer block around the center axis of rotation. SOLUTION: A balancer 11 is mounted on one end of a revolution turning shaft 8, and a wafer block 3 turned sideways is mounted on the other end. The revolution turning shaft 8 is fixed perpendicularly to an upper end of a spin rotating shaft 16. When spin drying with revolution around the apparatus is performed, the wafer block 3 is rotated by 90 degree into a vertical attitude. In this state, the revolution turning shaft 8 is turned through the spin rotating shaft 16, and hence the wafer block 3 and the balancer 11 are rotated around the spin rotating shaft 16. Air required for drying is supplied into a chamber 7 for rotating drying of the semiconductor wafer 1.