THIN FILM DEPOSITING DEVICE AND METHOD FOR DEPOSITING THIN FILM UTILIZING IT

PROBLEM TO BE SOLVED: To make it possible to deposit a thin film of an even thickness on a substrate, on which multiform films and the like exist, by a method wherein the temperature of a precursor solution transferred to a droplet spray device is adjusted, the precursor solution is made to convert into droplets and the droplets are injected, in a chamber wherein the pressure is adjusted, through a nozzle and are deposited on the substrate put on a stage. SOLUTION: In this thin film depositing device, a pump 3 makes a precursor solution transfer to a droplet spray device 5 and the droplet spray device 5 makes the temperature of the transferred precursor solution constant and makes the transferred solution convert into droplets utilizing ultrasonic waves. The droplets are flowed in a chamber 9 by transporting gas of a flow rate controlled by a mass flow velocity controller 7 and a stage 11 to be placed with a substrate R is installed in the chamber 9. Moreover, a pressure adjusting means 18 for adjusting the pressure in the chamber 9 is provided. In such a way, while the temperature of the transferred precursor solution is adjusted at 30 to 70 deg.C, the droplets are generated from the solution utilizing the device 5 and after that, the droplets are made to transfer into the chamber 9 to deposit on the substrate 8 for one to 20 minutes.