COPPER ALLOY EXCELLENT IN PLATING ADHESION
PROBLEM TO BE SOLVED: To provide a copper alloy excellent in plating adhesion, particularly Ni plating adhesion, as well as in tensile strength, elongation, electric conductivity, and hot creep characteristic. SOLUTION: This copper alloy has a composition consisting of, by weight, 0.5-3% Ni, 0.08-0....
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| creator | SAKAKIBARA TADAO SUZUKI TAKESHI |
| description | PROBLEM TO BE SOLVED: To provide a copper alloy excellent in plating adhesion, particularly Ni plating adhesion, as well as in tensile strength, elongation, electric conductivity, and hot creep characteristic. SOLUTION: This copper alloy has a composition consisting of, by weight, 0.5-3% Ni, 0.08-0.7% Si, 0.1-0.9% Sn, 0.1-3% Zn, 0.007-0.25% Fe, 0.001-0.2% P, 0.001-0.2% Mg, 0.001-0.01% Pb, further 0.0002-0.05%, in total, of one or >=2 elements among Li, In, Ba, Pd, Au, Pt, Rh, and Ir, and the balance Cu with inevitable impurities and further containing, if necessary, 0.01-0.3%, in total, of either or both of Cr and Zr. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH09209061A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH09209061A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH09209061A3</originalsourceid><addsrcrecordid>eNrjZNBy9g8IcA1ScPTx8Y9UcI1wdvXxcfULUfD0UwjwcQzx9HNXcHTxcA329PfjYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxXgEeBpZGBpYGZoaOxsSoAQBPziTI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>COPPER ALLOY EXCELLENT IN PLATING ADHESION</title><source>esp@cenet</source><creator>SAKAKIBARA TADAO ; SUZUKI TAKESHI</creator><creatorcontrib>SAKAKIBARA TADAO ; SUZUKI TAKESHI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a copper alloy excellent in plating adhesion, particularly Ni plating adhesion, as well as in tensile strength, elongation, electric conductivity, and hot creep characteristic. SOLUTION: This copper alloy has a composition consisting of, by weight, 0.5-3% Ni, 0.08-0.7% Si, 0.1-0.9% Sn, 0.1-3% Zn, 0.007-0.25% Fe, 0.001-0.2% P, 0.001-0.2% Mg, 0.001-0.01% Pb, further 0.0002-0.05%, in total, of one or >=2 elements among Li, In, Ba, Pd, Au, Pt, Rh, and Ir, and the balance Cu with inevitable impurities and further containing, if necessary, 0.01-0.3%, in total, of either or both of Cr and Zr.</description><edition>6</edition><language>eng</language><subject>ALLOYS ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; CURRENT COLLECTORS ; ELECTRICITY ; FERROUS OR NON-FERROUS ALLOYS ; LINE CONNECTORS ; METALLURGY ; TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><creationdate>1997</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19970812&DB=EPODOC&CC=JP&NR=H09209061A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19970812&DB=EPODOC&CC=JP&NR=H09209061A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SAKAKIBARA TADAO</creatorcontrib><creatorcontrib>SUZUKI TAKESHI</creatorcontrib><title>COPPER ALLOY EXCELLENT IN PLATING ADHESION</title><description>PROBLEM TO BE SOLVED: To provide a copper alloy excellent in plating adhesion, particularly Ni plating adhesion, as well as in tensile strength, elongation, electric conductivity, and hot creep characteristic. SOLUTION: This copper alloy has a composition consisting of, by weight, 0.5-3% Ni, 0.08-0.7% Si, 0.1-0.9% Sn, 0.1-3% Zn, 0.007-0.25% Fe, 0.001-0.2% P, 0.001-0.2% Mg, 0.001-0.01% Pb, further 0.0002-0.05%, in total, of one or >=2 elements among Li, In, Ba, Pd, Au, Pt, Rh, and Ir, and the balance Cu with inevitable impurities and further containing, if necessary, 0.01-0.3%, in total, of either or both of Cr and Zr.</description><subject>ALLOYS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRICITY</subject><subject>FERROUS OR NON-FERROUS ALLOYS</subject><subject>LINE CONNECTORS</subject><subject>METALLURGY</subject><subject>TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1997</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNBy9g8IcA1ScPTx8Y9UcI1wdvXxcfULUfD0UwjwcQzx9HNXcHTxcA329PfjYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxXgEeBpZGBpYGZoaOxsSoAQBPziTI</recordid><startdate>19970812</startdate><enddate>19970812</enddate><creator>SAKAKIBARA TADAO</creator><creator>SUZUKI TAKESHI</creator><scope>EVB</scope></search><sort><creationdate>19970812</creationdate><title>COPPER ALLOY EXCELLENT IN PLATING ADHESION</title><author>SAKAKIBARA TADAO ; SUZUKI TAKESHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH09209061A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1997</creationdate><topic>ALLOYS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRICITY</topic><topic>FERROUS OR NON-FERROUS ALLOYS</topic><topic>LINE CONNECTORS</topic><topic>METALLURGY</topic><topic>TREATMENT OF ALLOYS OR NON-FERROUS METALS</topic><toplevel>online_resources</toplevel><creatorcontrib>SAKAKIBARA TADAO</creatorcontrib><creatorcontrib>SUZUKI TAKESHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SAKAKIBARA TADAO</au><au>SUZUKI TAKESHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COPPER ALLOY EXCELLENT IN PLATING ADHESION</title><date>1997-08-12</date><risdate>1997</risdate><abstract>PROBLEM TO BE SOLVED: To provide a copper alloy excellent in plating adhesion, particularly Ni plating adhesion, as well as in tensile strength, elongation, electric conductivity, and hot creep characteristic. SOLUTION: This copper alloy has a composition consisting of, by weight, 0.5-3% Ni, 0.08-0.7% Si, 0.1-0.9% Sn, 0.1-3% Zn, 0.007-0.25% Fe, 0.001-0.2% P, 0.001-0.2% Mg, 0.001-0.01% Pb, further 0.0002-0.05%, in total, of one or >=2 elements among Li, In, Ba, Pd, Au, Pt, Rh, and Ir, and the balance Cu with inevitable impurities and further containing, if necessary, 0.01-0.3%, in total, of either or both of Cr and Zr.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | ALLOYS BASIC ELECTRIC ELEMENTS CHEMISTRY CURRENT COLLECTORS ELECTRICITY FERROUS OR NON-FERROUS ALLOYS LINE CONNECTORS METALLURGY TREATMENT OF ALLOYS OR NON-FERROUS METALS |
| title | COPPER ALLOY EXCELLENT IN PLATING ADHESION |
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