COPPER ALLOY EXCELLENT IN PLATING ADHESION

PROBLEM TO BE SOLVED: To provide a copper alloy excellent in plating adhesion, particularly Ni plating adhesion, as well as in tensile strength, elongation, electric conductivity, and hot creep characteristic. SOLUTION: This copper alloy has a composition consisting of, by weight, 0.5-3% Ni, 0.08-0.7% Si, 0.1-0.9% Sn, 0.1-3% Zn, 0.007-0.25% Fe, 0.001-0.2% P, 0.001-0.2% Mg, 0.001-0.01% Pb, further 0.0002-0.05%, in total, of one or >=2 elements among Li, In, Ba, Pd, Au, Pt, Rh, and Ir, and the balance Cu with inevitable impurities and further containing, if necessary, 0.01-0.3%, in total, of either or both of Cr and Zr.