POLYIMIDE RESIN COMPOSITION, PREPREG PREPARED USING THE SAME, PREPARATION OF COATING MATERIAL, AND CURING OF RESIN

PROBLEM TO BE SOLVED: To obtain a polyimide resin feedstock compsn. low in curing temp., excellent in moldability, free from the fear of volatile component generation from a thermal decomposition product during postcuring, and capable of forming a molded product or fiber-reinforced resin composite m...

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Hauptverfasser: ISHIKAWA NAOMOTO, NODA HITOSHI, SAKAGUCHI KOZO, HAYASHI NORIYA, HAYASHI SHUNICHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To obtain a polyimide resin feedstock compsn. low in curing temp., excellent in moldability, free from the fear of volatile component generation from a thermal decomposition product during postcuring, and capable of forming a molded product or fiber-reinforced resin composite material high in heat resistance, excellent in corrosion resistance against Lewis acid and Lewis bases and excellent in strength in a moistened state. SOLUTION: This addn. type compsn. having a high heat resistance and a high corrosion resistance is prepd. from a tetracarboxylic acid anhydride and/or tetracarboxylic acid diester compd., a diamine compd., and exo-3,6- epoxy-1,2,3,6-tetrahydrophthalic anhydride and/or an exo-3,6-epoxy-1,2,3,6- tetrahydrophthatic acid monoester compd. It is used to form a compsn. comprising a prepolymer thereof, and fiber-reinforced polyimide composite material prepreg, and coating material wherein it is used.