FABRICATION OF MICROMECHANISM DEVICE

PROBLEM TO BE SOLVED: To avoid a sticking effect by making an opening in an intermediate layer and forming an auxiliary structure for coupling a movable structure with a support in the opening and the removing the intermediate 'layer around the movable structure before removing the auxiliary st...

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Bibliographische Detailangaben
1. Verfasser:	UORUFUGANGU UERUNAA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT MEASURING MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TESTING TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To avoid a sticking effect by making an opening in an intermediate layer and forming an auxiliary structure for coupling a movable structure with a support in the opening and the removing the intermediate 'layer around the movable structure before removing the auxiliary structure. SOLUTION: An opening 6 for exposing a movable structure 3 and supports 1, 4 is made in an intermediate layer 2 and then the opening 6 is filled with a photoresist layer 7 to form an auxiliary structure 7a for coupling the movable structure 3 with the supports 1, 4. The photoresist layer 7 having an opening exposing the movable structure 3 is constructed into a mask and the intermediate layer 2 around the movable structure 3 is removed through the opening by etching process before removing the auxiliary structure 7a by a dry etching process. According to the method, the sticking effect can be avoided.