ELECTRONIC PART MOUNTING STRUCTURE ON BOARD
PROBLEM TO BE SOLVED: To stabilize the surface mounting of an electronic part which is not formed in a chip form, and to make it possible to realize automatic mounting. SOLUTION: The titled structure is an integrally molded article made of electrically and thermally insulating resin material, the co...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | SAKAGAMI FUKUMATSU YAMAJI ICHIRO |
| description | PROBLEM TO BE SOLVED: To stabilize the surface mounting of an electronic part which is not formed in a chip form, and to make it possible to realize automatic mounting. SOLUTION: The titled structure is an integrally molded article made of electrically and thermally insulating resin material, the contact surface part 21 with a board 9 is flat, and the lead out parts 23 and 24 of lead-out lead wires 3 and 4 are provided on the outer side face part 22 which is integrally formed with the contact surface part 21. The inner surface 25 of outer side face is formed in the shape which comes in contact with the whole part or a part of the outside surface of an electronic part body 2, the electronic part body 2 is supported by the inner surface 25, the led out lead wires 3 and 4 are bent almost in L-shape, and the bent horizontal edge portions 10 and 11 are mounted on the board 9 by solderings 12 and 13. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH09199822A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH09199822A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH09199822A3</originalsourceid><addsrcrecordid>eNrjZNB29XF1Dgny9_N0VghwDApR8PUP9Qvx9HNXCA4JCnUOCQ1yVfD3U3Dydwxy4WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8V4BHgaWhpaWFkZGjsbEqAEAlJ4lag</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ELECTRONIC PART MOUNTING STRUCTURE ON BOARD</title><source>esp@cenet</source><creator>SAKAGAMI FUKUMATSU ; YAMAJI ICHIRO</creator><creatorcontrib>SAKAGAMI FUKUMATSU ; YAMAJI ICHIRO</creatorcontrib><description>PROBLEM TO BE SOLVED: To stabilize the surface mounting of an electronic part which is not formed in a chip form, and to make it possible to realize automatic mounting. SOLUTION: The titled structure is an integrally molded article made of electrically and thermally insulating resin material, the contact surface part 21 with a board 9 is flat, and the lead out parts 23 and 24 of lead-out lead wires 3 and 4 are provided on the outer side face part 22 which is integrally formed with the contact surface part 21. The inner surface 25 of outer side face is formed in the shape which comes in contact with the whole part or a part of the outside surface of an electronic part body 2, the electronic part body 2 is supported by the inner surface 25, the led out lead wires 3 and 4 are bent almost in L-shape, and the bent horizontal edge portions 10 and 11 are mounted on the board 9 by solderings 12 and 13.</description><edition>6</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CAPACITORS ; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>1997</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19970731&DB=EPODOC&CC=JP&NR=H09199822A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19970731&DB=EPODOC&CC=JP&NR=H09199822A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SAKAGAMI FUKUMATSU</creatorcontrib><creatorcontrib>YAMAJI ICHIRO</creatorcontrib><title>ELECTRONIC PART MOUNTING STRUCTURE ON BOARD</title><description>PROBLEM TO BE SOLVED: To stabilize the surface mounting of an electronic part which is not formed in a chip form, and to make it possible to realize automatic mounting. SOLUTION: The titled structure is an integrally molded article made of electrically and thermally insulating resin material, the contact surface part 21 with a board 9 is flat, and the lead out parts 23 and 24 of lead-out lead wires 3 and 4 are provided on the outer side face part 22 which is integrally formed with the contact surface part 21. The inner surface 25 of outer side face is formed in the shape which comes in contact with the whole part or a part of the outside surface of an electronic part body 2, the electronic part body 2 is supported by the inner surface 25, the led out lead wires 3 and 4 are bent almost in L-shape, and the bent horizontal edge portions 10 and 11 are mounted on the board 9 by solderings 12 and 13.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CAPACITORS</subject><subject>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1997</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB29XF1Dgny9_N0VghwDApR8PUP9Qvx9HNXCA4JCnUOCQ1yVfD3U3Dydwxy4WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8V4BHgaWhpaWFkZGjsbEqAEAlJ4lag</recordid><startdate>19970731</startdate><enddate>19970731</enddate><creator>SAKAGAMI FUKUMATSU</creator><creator>YAMAJI ICHIRO</creator><scope>EVB</scope></search><sort><creationdate>19970731</creationdate><title>ELECTRONIC PART MOUNTING STRUCTURE ON BOARD</title><author>SAKAGAMI FUKUMATSU ; YAMAJI ICHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH09199822A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1997</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CAPACITORS</topic><topic>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>SAKAGAMI FUKUMATSU</creatorcontrib><creatorcontrib>YAMAJI ICHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SAKAGAMI FUKUMATSU</au><au>YAMAJI ICHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC PART MOUNTING STRUCTURE ON BOARD</title><date>1997-07-31</date><risdate>1997</risdate><abstract>PROBLEM TO BE SOLVED: To stabilize the surface mounting of an electronic part which is not formed in a chip form, and to make it possible to realize automatic mounting. SOLUTION: The titled structure is an integrally molded article made of electrically and thermally insulating resin material, the contact surface part 21 with a board 9 is flat, and the lead out parts 23 and 24 of lead-out lead wires 3 and 4 are provided on the outer side face part 22 which is integrally formed with the contact surface part 21. The inner surface 25 of outer side face is formed in the shape which comes in contact with the whole part or a part of the outside surface of an electronic part body 2, the electronic part body 2 is supported by the inner surface 25, the led out lead wires 3 and 4 are bent almost in L-shape, and the bent horizontal edge portions 10 and 11 are mounted on the board 9 by solderings 12 and 13.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JPH09199822A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | ELECTRONIC PART MOUNTING STRUCTURE ON BOARD |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-28T00%3A59%3A13IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SAKAGAMI%20FUKUMATSU&rft.date=1997-07-31&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH09199822A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |