ELECTRONIC PART MOUNTING STRUCTURE ON BOARD

PROBLEM TO BE SOLVED: To stabilize the surface mounting of an electronic part which is not formed in a chip form, and to make it possible to realize automatic mounting. SOLUTION: The titled structure is an integrally molded article made of electrically and thermally insulating resin material, the co...

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Bibliographische Detailangaben
Hauptverfasser: SAKAGAMI FUKUMATSU, YAMAJI ICHIRO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To stabilize the surface mounting of an electronic part which is not formed in a chip form, and to make it possible to realize automatic mounting. SOLUTION: The titled structure is an integrally molded article made of electrically and thermally insulating resin material, the contact surface part 21 with a board 9 is flat, and the lead out parts 23 and 24 of lead-out lead wires 3 and 4 are provided on the outer side face part 22 which is integrally formed with the contact surface part 21. The inner surface 25 of outer side face is formed in the shape which comes in contact with the whole part or a part of the outside surface of an electronic part body 2, the electronic part body 2 is supported by the inner surface 25, the led out lead wires 3 and 4 are bent almost in L-shape, and the bent horizontal edge portions 10 and 11 are mounted on the board 9 by solderings 12 and 13.