MICROMECHANISM DEVICE AND ITS MANUFACTURING METHOD
PROBLEM TO BE SOLVED: To obtain the micromechanism optimum for integrating a microsystem by a method wherein a vacancy is provided with a hood including a cover layer made of a diaphragm having aperture parts in almost even thickness and a doped glass made cover layer. SOLUTION: A small aperture par...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To obtain the micromechanism optimum for integrating a microsystem by a method wherein a vacancy is provided with a hood including a cover layer made of a diaphragm having aperture parts in almost even thickness and a doped glass made cover layer. SOLUTION: A small aperture part 4a and a large aperture part 4b are made in a diaphragm 3 and then vacancies Ha, Hb are formed beneath the aperture parts by etching away an auxiliary layer 2 down to the level on a substrate 1 using isotropical etching process. Furthermore, a BPSG layer is formed selecting its thickness so that one each of narrow gap closing without fail by reflow after separating may be made on the aperture part 3a while relatively large gap on the aperture part 4b. Next, a parallel planar hood D airtightly closing the vacancy Ha is formed on the flat surface of the vacancy Ha reflowing step to completely fill up the aperture part 4a with a glass layer 5 so that the hood D made of the diaphragm 3 and the cover layer 5 may be made in completely even thickness while inabling another even hood D to be obtained on upper and lower edges also. |
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